JPH0431741Y2 - - Google Patents
Info
- Publication number
- JPH0431741Y2 JPH0431741Y2 JP1986170000U JP17000086U JPH0431741Y2 JP H0431741 Y2 JPH0431741 Y2 JP H0431741Y2 JP 1986170000 U JP1986170000 U JP 1986170000U JP 17000086 U JP17000086 U JP 17000086U JP H0431741 Y2 JPH0431741 Y2 JP H0431741Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- substrates
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 22
- 230000017525 heat dissipation Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986170000U JPH0431741Y2 (en]) | 1986-11-05 | 1986-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986170000U JPH0431741Y2 (en]) | 1986-11-05 | 1986-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6375961U JPS6375961U (en]) | 1988-05-20 |
JPH0431741Y2 true JPH0431741Y2 (en]) | 1992-07-30 |
Family
ID=31104317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986170000U Expired JPH0431741Y2 (en]) | 1986-11-05 | 1986-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0431741Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6025166B2 (ja) * | 2012-05-02 | 2016-11-16 | オリンパス株式会社 | 携帯機器の電気基板接続構造 |
-
1986
- 1986-11-05 JP JP1986170000U patent/JPH0431741Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6375961U (en]) | 1988-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5296652A (en) | Apparatus for attaching a circuit component to a printed circuit board | |
JPH0223024Y2 (en]) | ||
JPH0713191Y2 (ja) | コネクタ | |
EP0262284B1 (en) | Connection apparatus for integrated circuit | |
KR850008605A (ko) | 무선장치용 인쇄회로기판 및 회로조립체 | |
JPH0412714Y2 (en]) | ||
JPH07273234A (ja) | 電子パッケージ・アセンブリおよびそれと一緒に使用するコネクタ | |
US4504886A (en) | Grounding and positioning clip for a power transistor | |
US11081828B2 (en) | Power module housing | |
JPH0431741Y2 (en]) | ||
JP3674056B2 (ja) | 電気機器における基板固定金具 | |
US4799314A (en) | Method of mounting a printed circuit board | |
JPH0349433Y2 (en]) | ||
JP3232723B2 (ja) | 電子回路装置およびその製造方法 | |
JPH11330640A (ja) | プリント配線板 | |
JP4142222B2 (ja) | 半導体装置用保持体 | |
JPH071836Y2 (ja) | 回路基板のシールド装置 | |
JP3494541B2 (ja) | 電子部品用容器及びこれを用いた水晶発振器 | |
JP2569995B2 (ja) | バックボード相互間の接続構造 | |
US5995371A (en) | Integrated dielectric substrate | |
JPH0211731Y2 (en]) | ||
JP2004061290A (ja) | 半導体装置用評価装置 | |
JPH05327155A (ja) | 回路モジュール用コネクタ | |
JPH0220843Y2 (en]) | ||
JPS59107195U (ja) | プリント配線基板回路装置 |